Revistas
Revista:
ACTA BIOMATERIALIA
ISSN:
1742-7061
Año:
2022
Vol.:
141
Págs.:
264 - 279
Biomechanical properties of adipose tissue (AT) are closely involved in the development of obesity associated comorbidities. Bariatric surgery (BS) constitutes the most effective option for a sustained weight loss in addition to improving obesity-associated metabolic diseases including type 2 diabetes (T2D). We aimed to determine the impact of weight loss achieved by BS and caloric restriction (CR) on the biomechanical properties of AT. BS but not CR changed the biomechanical properties of epididymal white AT (EWAT) from a diet-induced obesity rat model, which were associated with metabolic improvements. We found decreased gene expression levels of collagens and Lox together with increased elastin and Mmps mRNA levels in EWAT after BS, which were also associated with the biomechanical properties. Moreover, an increased blood vessel density was observed in EWAT after surgery, confirmed by an up regulation of Acta2 and Antxr1 gene expression levels, which was also correlated with the biomechanical properties. Visceral AT from patients with obesity showed increased stiffness after tensile tests compared to the EWAT from the animal model. This study uncovers new insights into EWAT adaptation after BS with decreased collagen crosslink and synthesis as well as an increased degradation together with enhanced blood vessel density providing, simultaneously, higher stiffness and more ductility.
Statement of Significance
Biomechanical properties of the adipose tissue (AT) are closely involved in the development of obesity associated comorbidities. In this study, we show for the first time that biomechanical properties of AT determined by E , UTS and strain at UTS are decreased in obesity, being increased after bariatric surgery by the promotion of ECM remodelling and neovascularization. Moreover, these changes in biomechanical properties are associated with improvements in metabolic homeostasis. Consistently, a better characterization of the plasticity and biomechanical properties of the AT after bariatric surgery opens up a new field for the development of innovative strategies for the reduction of fibrosis and inflammation in AT as well as to better understand obesity and its associated comorbidities.
Revista:
MATERIALS
ISSN:
1996-1944
Año:
2019
Vol.:
12
N°:
19
Págs.:
3105
In the treatment of bone non-unions, an alternative to bone autografts is the use of bone morphogenetic proteins (BMPs), e.g., BMP-2, BMP-7, with powerful osteoinductive and osteogenic properties. In clinical settings, these osteogenic factors are applied using absorbable collagen sponges for local controlled delivery. Major side effects of this strategy are derived from the supraphysiological doses of BMPs needed, which may induce ectopic bone formation, chronic inflammation, and excessive bone resorption. In order to increase the efficiency of the delivered BMPs, we designed cryostructured collagen scaffolds functionalized with hydroxyapatite, mimicking the structure of cortical bone (aligned porosity, anisotropic) or trabecular bone (random distributed porosity, isotropic). We hypothesize that an anisotropic structure would enhance the osteoconductive properties of the scaffolds by increasing the regenerative performance of the provided rhBMP-2. In vitro, both scaffolds presented similar mechanical properties, rhBMP-2 retention and delivery capacity, as well as scaffold degradation time. In vivo, anisotropic scaffolds demonstrated better bone regeneration capabilities in a rat femoral critical-size defect model by increasing the defect bridging. In conclusion, anisotropic cryostructured collagen scaffolds improve bone regeneration by increasing the efficiency of rhBMP-2 mediated bone healing.
Revista:
JOURNAL OF MATERIALS SCIENCE
ISSN:
0022-2461
Año:
2019
Vol.:
54
N°:
6
Págs.:
5044 - 5060
The development of multiphase steels to obtain an optimum balance between strength and ductility is a very active topic of research. In particular, carbide-free bainitic steels have shown promising mechanical properties, making them good candidates for replacing well-established first-generation steels in the automotive industry. In this work, a detailed analysis of the microstructures attainable through overaging treatments is tackled in two bainitic steels with different Si contents. The focus has been put onto the mechanical characterization, via nanoindentation, of the phases that are generated as a consequence of the change in the bainitic treatment conditions and the final cooling to room temperature. The results show the suitability of the nanoindentation technique for gaining knowledge about the underlying transformation-related phenomena and for measuring the relative difference in hardness of the various micro-constituents. The latter is a key factor in understanding the origin of the damage in this kind of steels.
Revista:
JOURNAL OF TISSUE ENGINEERING AND REGENERATIVE MEDICINE
ISSN:
1932-6254
Año:
2019
Vol.:
13
N°:
5
Págs.:
742 - 752
An attractive alternative to bone autografts is the use of autologous mesenchymal progenitor cells (MSCs) in combination with biomaterials. We compared the therapeutic potential of different sources of mesenchymal stem cells in combination with biomaterials in a bone nonunion model. A critical-size defect was created in Sprague-Dawley rats. Animals were divided into six groups, depending on the treatment to be applied: bone defect was left empty (CTL); treated with live bone allograft (LBA); hrBMP-2 in collagen scaffold (CSBMP2); acellular polycaprolactone scaffold (PCL group); PCL scaffold containing periosteum-derived MSCs (PCLPMSCs) and PCL containing bone marrow-derived MSCs (PCLBMSCs). To facilitate cell tracking, both MSCs and bone graft were isolated from green fluorescent protein (GFP)-transgenic rats. CTL group did not show any signs of healing during the radiological follow-up (n = 6). In the LBA group, all the animals showed bone bridging (n = 6) whereas in the CSBMP2 group, four out of six animals demonstrated healing. In PCL and PCLPMSCs groups, a reduced number of animals showed radiological healing, whereas no healing was detected in the PCLBMSCs group. Using microcomputed tomography, the bone volume filling the defect was quantified, showing significant new bone formation in the LBA, CSBMP2, and PCLPMSCs groups when compared with the CTL group. At 10 weeks, GFP positive cells were detected only in the LBA group and restricted to the outer cortical bone in close contact with the periosteum. Tracking of cellular implants demonstrated significant survival of the PMSCs when compared with BMSCs. In conclusion, PMSCs improve bone regeneration being suitable for mimetic autograft design.
Revista:
INTERNATIONAL JOURNAL OF REFRACTORY METALS AND HARD MATERIALS
ISSN:
0263-4368
Año:
2018
Vol.:
72
Págs.:
39 - 44
Recently, there have been significant efforts to develop micro-mechanical models for a better understanding of in-service performance of WC-Co components. However, reliable information about the mechanical properties of individual features like grains or interfaces is still lacking. In this work, micro-beam testing has been used for analyzing the fracture strength of different WC-WC interfaces in a WC-6.5 wt%Co alloy. The method is based on machining cantilever beams by using Focused Ion Beam so that a single WC-WC interface is isolated from the rest of the microstructure. This machining is carried out in order to have the selected interface at a certain distance for the fixed end and perpendicular to the cantilever axis. CSL2 boundaries and randomly oriented boundaries have been identified by means of EBSD and subsequently tested by nanoindentation until fracture. Load-displacement curves confirm that CSL2 boundaries are stronger than the others and post mortem analyses indicates that the fracture mechanisms are different depending on the orientation between adjacent WC grains. This approach could be used to investigate the intrinsic strength of other interfaces present in hardmetals (i.e. WC/Co, FCC carbides/Co, FCC carbides/WC) and how it is related with processing parameters or in-service conditions.
Autores:
Echegaray, K.; Andreu, Ion; Lazkano, A.; et al.
Revista:
REVISTA ESPAÑOLA DE CARDIOLOGIA
ISSN:
0300-8932
Año:
2017
Vol.:
70
N°:
10
Págs.:
832 - 840
Introducción y objetivos
Se ha estudiado la localización anatómica, las propiedades biomecánicas y el fenotipo molecular del colágeno miocárdico tisular en 40 pacientes con estenosis aórtica grave, fracción de eyección conservada y síntomas de insuficiencia cardiaca.
Métodos
Se obtuvieron 2 biopsias transmurales de la pared libre del ventrículo izquierdo. La fracción del volumen de colágeno (FVC) se cuantificó mediante rojo picrosirio y la rigidez, mediante el módulo elástico de Young (YEM) evaluado con microscopia de fuerza atómica en regiones misiales y no misiales. Las FVC de tipos I y III se cuantificaron mediante microscopia confocal en áreas con determinación del YEM.
Resultados
Comparados con sujetos de control, la FVC misial y no misial y el cociente FVC no misial:misial (p < 0,05) estaban incrementados en los pacientes. El cociente entre la velocidad pico de la onda E mitral y la velocidad E del anillo lateral mitral de los pacientes se correlacionaba con la FVC no misial (r = 0,330; p = 0,046) y con el cociente FVC no misial:misial (r = 0,419; p = 0,012). El cociente FVCI:FVCIII y el YEM aumentaban (p ¿ 0,001) en regiones no misiales respecto de las misiales, con correlación entre ellos (r = 0,895; p < 0,001).
Conclusiones
En la estenosis aórtica grave con fracción de eyección conservada y síntomas de insuficiencia cardiaca, la disfunción diastólica se asocia con un depósito no misial de colágeno aumentado, predominantemente de tipo I y con mayor rigidez. Las características del colágeno tisular pueden contribuir a la disfunción diastólica en estos pacientes.
Autores:
Tanner, B.; Garagorri, J.; Gorostegui-Colinas, E.; et al.
Revista:
JOURNAL OF APPLIED CRYSTALLOGRAPHY
ISSN:
1600-5767
Año:
2016
Vol.:
49
Págs.:
250 - 259
The asterism observed in white radiation X-ray diffraction images (topographs) of extended cracks in silicon is investigated and found to be associated with material that is close to breakout and surrounded by extensive cracking. It is a measure of the mechanical damage occurring when the fracture planes do not follow the low-index cleavage planes associated with the crystal structure. It is not related to a propensity for some cracked wafers to shatter during subsequent high-temperature processing. There is no correlation between crack morphology and alignment of an indenter with respect to the orientation of a silicon wafer, the cracks being generated from the apices of the indenter and having threefold symmetry for Berkovich indents and fourfold symmetry for Vickers indents. X-ray diffraction imaging (XRDI) of indents does not reveal this underlying symmetry and the images exhibit a very substantial degree of variation in their extent. This arises because the XRDI contrast is sensitive to the long-range strain field around the indent and breakout reduces the extent of this long-range strain field. Breakout is also detected in the loss of symmetry in the short-range strain field imaged by scanning micro-Raman spectroscopy. Weak fourfold symmetric features at the extremes of the images, and lying along < 110 > directions, are discussed in the context of slip generated below the room-temperature indents. Scanning electron microscopy imaging of the region around an indent during focused ion beam milling has permitted the three-dimensional reconstruction of the crack morphology. The surface-breaking Palmqvist cracks are found to be directly connected to the median subsurface cracks, and the presence of extensive lateral cracks is a prerequisite for material breakout at indenter loads above 200 mN. The overall crack shape agrees with that predicted from simulation.
Autores:
Tanner, B.; Garagorri, J.; Gorostegui-Colinas, E.; et al.
Revista:
INTERNATIONAL JOURNAL OF FRACTURE
ISSN:
0376-9429
Año:
2015
Vol.:
195
N°:
1
Págs.:
79 - 85
The geometry of fracture associated with the propagation of cracks originating at the edges of (001) oriented, 200 mm diameter silicon wafers has been investigated under two regimes of high temperature processing. Under spike annealing, fracture did not occur on low index planes and all except one wafer exhibited crack patterns that started initially to run radially, but after a distance of typically 20-30 mm, turned and ran almost tangentially. Wafers subjected to plateau annealing, with a 60 s dwell time at high temperature, predominantly fractured through radial cracks running along directions. X-ray diffraction imaging reveals substantial slip in all wafers subjected to plateau annealing. We demonstrate using finite element (FE) modelling that the change in fracture geometry is associated with this plastic deformation, which changes the stress distribution during the cooling phase of the rapid thermal annealing cycle. FE simulations without plastic relaxation show that the radial component of the thermal stress distribution is compressive in the centre of the wafer, causing the crack to run tangentially. Simulations incorporating temperature dependent plasticity showed that the equivalent stress becomes tensile when the plateau anneal allows time for significant plastic relaxation, permitting the crack to continue propagating linearly.
Revista:
INTERNATIONAL JOURNAL OF REFRACTORY METALS AND HARD MATERIALS
ISSN:
0263-4368
Año:
2014
Vol.:
43
Págs.:
236 - 240
Microbeam testing is proposed as a new method for analysing the mechanical properties of individual microstructural features in WC-Co hardmetals; i.e. portions of WC grains or a single metallic ligament. Firstly, cantilever microbeams with dimensions below the microstructural scale of the material are machined by means of a focused ion beam (FIB). Afterwards, these beams are bended to fracture by means of an instrumented nanoindenter. In this way, both portions of WC grains and binder phase ligaments are broken while simultaneously recording the load and the vertical displacement of the nanoindenter tip. These cracking events are detected as sudden steps in the load vs. displacement curves. Afterwards, a scanning electron microscope is used to measure the distance from the main crack to the beam clamping. From these data, the stresses at which portions of cobalt ligaments and WC grains fail are estimated from linear elastic theory and FEM models.
Revista:
THIN SOLID FILMS
ISSN:
0040-6090
Año:
2014
Vol.:
571
Págs.:
296 - 301
Microelectronic industry is driven by the continuous miniaturization process conducing to the introduction of materials with better performance. These materials are subjected to stresses mainly due to thermal mismatch, microstructural changes or process integration which can be in the origin of mechanical reliability issues. To study these phenomena and even electromigration a good mechanical characterization of the materials is needed. This work aims at developing tests to assess fracture and elastoplastic behavior of thin Cu films. The tests developed are based on the deflection of microbeams (micromachined using a focused ion beam) using a nanoindenter. Different test geometries for microbeams have been evaluated and quantitative data have been obtained combining experimental results with analytical or numerical models, depending on the property under study. Microbeam response shows a strong dependence on the orientation of the grains close to the fixed end. Grain orientation has been measured by electron backscatter diffraction and the plastic behavior has been modeled by the finite element method using an in-house crystal plasticity subroutine. The effect of film thickness on fracture energy has been determined from tests of notched beams. (C) 2014 Elsevier B.V. All rights reserved.
Revista:
THIN SOLID FILMS
ISSN:
0040-6090
Año:
2014
Vol.:
564
Págs.:
314 - 320
The continuous miniaturization process in the microelectronic industry, along with the introduction of Interlayer Dielectrics (ILDs) with poorer mechanical properties, makes necessary the development of characterization techniques to evaluate the mechanical performance of very thin films. This work presents a mechanical characterization technique for thin films based on membrane testing. Membranes, micromachined with anisotropic wet etching of Si, are tested to fracture using a nanoindenter to apply the load and register the provoked deflection. The technique is applied to the fracture characterization of two different ILDs with four thicknesses ranging from 100 nm to 500 nm. Combination of experiments and finite element simulations allows for the calculation of the strength of the materials from the fracture load. The technique permits to discriminate both ILDs and to establish clear thickness dependence: for both materials, 100 nm films show a significant lower strength while no effect of film thickness on strength is observed in the range between 200 and 500 nm. A sensitivity analysis of the outcome of the technique, the fracture stress, to the variability of the input parameters is presented, showing the robustness of the proposed approach: the experimental error in the fracture stress is smaller than the variation in the input parameters.
Revista:
ACTA MATERIALIA
ISSN:
1359-6454
Año:
2014
Vol.:
71
Págs.:
44 - 55
The continuous process of miniaturization in the microelectronics industry requires the introduction of new, thinner interlayer dielectric (ILD) materials with poorer mechanical properties. As a consequence, new mechanical characterization techniques are needed in the industry to evaluate very thin films. This work presents a new fracture characterization technique for thin films, called "dual tip indentation" (DTI). The technique takes advantage of a particular geometry of the indentation tip to provoke shallow and controlled cracking on the targeted brittle thin film. The technique is applied to the fracture characterization of two different ILD with four thicknesses, ranging from 100 nm to 500 nm. Further fractographic analysis, along with finite element modeling, shows that it is possible to extract intrinsic fracture properties from the fracture load. The technique allows one to discriminate between the ILD and, for both materials, 100 nm films show lower strength. No effect of film thickness on strength is observed in the range between 200 and 500 nm. The results from DTI compare well with those previously obtained for the same materials from membrane testing, taking into account the differences in volume tested.
Revista:
ACTA BIOMATERIALIA
ISSN:
1742-7061
Año:
2014
Vol.:
10
N°:
7
Págs.:
3235 - 3242
Infarcted hearts are macroscopically stiffer than healthy organs. Nevertheless, although cell behavior is mediated by the physical features of the cell niche, the intrinsic micromechanical properties of healthy and infarcted heart extracellular matrix (ECM) remain poorly characterized. Using atomic force microscopy, we studied ECM micromechanics of different histological regions of the left ventricle wall of healthy and infarcted mice. Hearts excised from healthy (n = 8) and infarcted mice (n = 8) were decellularized with sodium dodecyl sulfate and cut into 12 gm thick slices. Healthy ventricular ECM revealed marked mechanical heterogeneity across histological regions of the ventricular wall with the effective Young's modulus ranging from 30.2 +/- 2.8 to 74.5 +/- 8.7 kPa in collagen- and elastin-rich regions of the myocardium, respectively. Infarcted ECM showed a predominant collagen composition and was 3-fold stiffer than collagen-rich regions of the healthy myocardium. ECM of both healthy and infarcted hearts exhibited a solid-like viscoelastic behavior that conforms to two power-law rheology. Knowledge of intrinsic micromechanical properties of the ECM at the length scale at which cells sense their environment will provide further insight into the cell-scaffold interplay in healthy and infarcted hearts.
Autores:
Danilewsky, A.; Wittge, J.; Kiefl, K.; et al.
Revista:
JOURNAL OF APPLIED CRYSTALLOGRAPHY
ISSN:
0021-8898
Año:
2013
Vol.:
46
Págs.:
849 - 855
The behaviour of microcracks in silicon during thermal annealing has been studied using in situ X-ray diffraction imaging. Initial cracks are produced with an indenter at the edge of a conventional Si wafer, which was heated under temperature gradients to produce thermal stress. At temperatures where Si is still in the brittle regime, the strain may accumulate if a microcrack is pinned. If a critical value is exceeded either a new or a longer crack will be formed, which results with high probability in wafer breakage. The strain reduces most efficiently by forming (hhl) or (hkl) crack planes of high energy instead of the expected low-energy cleavage planes like {111}. Dangerous cracks, which become active during heat treatment and may shatter the whole wafer, can be identified from diffraction images simply by measuring the geometrical dimensions of the strain-related contrast around the crack tip. Once the plastic regime at higher temperature is reached, strain is reduced by generating dislocation loops and slip bands and no wafer breakage occurs. There is only a small temperature window within which crack propagation is possible during rapid annealing.
Autores:
Tanner, B.K.; Wittge, J.; Vagovic, P.; et al.
Revista:
POWDER DIFFRACTION
ISSN:
0885-7156
Año:
2013
Vol.:
28
N°:
2
Págs.:
95 - 99
The apparatus for X-ray diffraction imaging (XRDI) of 450-mm wafers, is now placed at the ANKA synchrotron radiation source in Karlsruhe, is described in the context of the drive to inspect wafers for plastic deformation or mechanical damage. It is shown that full wafer maps at high resolution can be expected to take a few hours to record. However, we show from experiments on 200-, 300-, and 450-mm wafers that a perimeter-scan on a 450-mm wafer, to pick up edge damage and edge-originated slip sources, can be achieved in just over 10 min. Experiments at the Diamond Light Source, on wafers still in their cassettes, suggest that clean-room conditions may not be necessary for such characterization. We conclude that scaling up of the 300-mm format Jordan Valley tools, together with the existing facility at ANKA, provides satisfactory capability for future XRDI analysis of 450-mm wafers.
Autores:
Jauss, T.; Danilewsky, A.N.; Wittge, J.; et al.
Revista:
CRYSTAL RESEARCH AND TECHNOLOGY
ISSN:
0232-1300
Año:
2012
Vol.:
47
N°:
3
Págs.:
253 - 260
To examine the impact of mechanical defects on the crystal lattice of silicon, controlled damage was applied to silicon wafers by a nanoindendation method. With increasing loads of 1, 5 and 50 N, the area with micro-cracks and strain around the indents increases. The damage is characterised by high resolution diffractometry using a conventional X-ray tube. Spatially resolved rocking curves were recorded across the indents and analysed with respect to full width at half maximum. From reciprocal space maps the amount of strain and tilt around the indents is separated.
Autores:
Tanner, B.K.; Fossati, M.C.; Garagorri, J.; et al.
Revista:
APPLIED PHYSICS LETTERS
ISSN:
0003-6951
Año:
2012
Vol.:
101
N°:
4
Págs.:
41903
We show that x-ray diffraction imaging (topography) and finite-element modelling can determine accurately the probability of propagation of individual cracks in brittle single crystal materials. The x-ray image of the crack provides a critical parameter for crack propagation which informs a predictive model, enabling us to identify critical defects that lead to catastrophic shattering of silicon wafers during high temperature thermal processing. Wafers fracture on cooling and finite element modelling shows that, during cooling, the tangential stress at the wafer edge is tensile and results in crack propagation. The predicted fracture geometry agrees extremely well with that observed experimentally.
Revista:
JOURNAL OF APPLIED PHYSICS
ISSN:
0021-8979
Año:
2012
Vol.:
111
N°:
9
Págs.:
94901
X-ray diffraction imaging of 200mm diameter (100) oriented double-side polished silicon wafers has revealed that the slip band distribution, following rapid thermal annealing (RTA), has a lower symmetry than predicted from the material crystallography. Finite element (FE) modelling of the thermal processes has been undertaken and it is found that, in order to predict the measured temperature distribution during the annealing sequence in a commercial RTA furnace, an anisotropic heat flux distribution in the furnace must be included. When such an anisotropic heat flux is used to predict the wafer temperature, it is found that the temperature gradients are not equivalent in the radial direction. Calculation of the resolved shear stresses on the five independent slip systems associated with these gradients predicts asymmetry between the stress on slip bands that project into the [011] and [0 (1) over bar1] directions. The anisotropy of the resolved shear stress distribution predicts accurately the asymmetry of the experimentally observed slip band length and density. Rotation of the wafer with respect to the furnace axes results in characteristic and systematic changes in the symmetry of the distribution, which is in good agreement with the finite element predictions.
Autores:
Danilewsky, A.N.; Wittge, J.; Croell, A.; et al.
Revista:
JOURNAL OF CRYSTAL GROWTH
ISSN:
0022-0248
Año:
2011
Vol.:
318
N°:
1
Págs.:
1157 - 1163
White beam X-ray diffraction imaging (topography) with an optimised CCD-detector system is used to monitor in-situ and in real time the nucleation, growth and movement of dislocations in silicon at high temperatures. It can be shown, that damage like microcracks and the surrounding strain fields in a wafer act as sources for dislocation loops, which end in slip bands far away from the source. The dislocations are arranged in channels of parallel {1 1 1} glide planes, which become visible as bands of parallel surface steps when the dislocations slip out on the back or front sides of the wafer. The width of such a channel or band depend on the dimensions of the damaged volume where the dislocations nucleate. This can be explained with a simple geometrical model.
Autores:
Danilewsky, A.N.; Wittge, J.; Hess, A.; et al.
Revista:
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE
ISSN:
1862-6300
Año:
2011
Vol.:
208
N°:
11
Págs.:
2499 - 2504
We describe a rapid digital system for X-ray diffraction imaging and demonstrate its application to the real-time identification of edge defects in a silicon wafer that had been subjected to rapid thermal annealing. The application of the system to the in situ study of slip nucleation at the location of mechanical wafer defects, indents and a thermocouple, and the subsequent dislocation dynamics is presented.
Autores:
Tanner, B.K.; Wittge, J.; Allen, D.; et al.
Revista:
JOURNAL OF APPLIED CRYSTALLOGRAPHY
ISSN:
0021-8898
Año:
2011
Vol.:
44
Págs.:
489 - 494
High-resolution X-ray diffraction imaging of 200 mm silicon wafers following rapid thermal annealing at a temperature of 1270 K has revealed the presence of many early stage sources of thermal slip associated with the wafer edge. Dislocation sources are primarily at the wafer extremity, though many are generated by damage at the edge of the bevel incline on the wafer surface. A smaller fraction of sources is associated with other regions of localized damage, probably relating to protrusions on the wafer support. The geometry of the latter is similar to that of dislocation sources generated by controlled indentation on the wafer surface. It is concluded that rapid spike annealing at high temperature does not suppress the nucleation of slip, but rather the rapidity of the process prevents the propagation of the dislocations in the slip band into the wafer.
Autores:
Danilewsky, A.; Wittge, J.; Hess, A.; et al.
Revista:
NUCLEAR INSTRUMENTS AND METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS
ISSN:
0168-583X
Año:
2010
Vol.:
268
N°:
3 - 4
Págs.:
399 - 402
The generation and propagation of dislocations in Si at high temperature is observed in situ with white beam X-ray topography. For the heating experiments a double ellipsoidal mirror furnace was installed at the Topo-Tomo beamline of the ANKA synchrotron light source, Research Centre Karlsruhe, Germany. Details of the experimental set-up and the first results on the Occurrence of dislocations are presented. Artificial damage was generated in commercial (1 0 0) Si wafers using a nanoindenter with Various loads. The applied forces for each set of indents were varied from 100 to 500 mN, respectively. After heating to approx. 790 degrees C large area transmission topographs were taken every 30 min which were then compared to room temperature topographs before and after heating. At the outset straight 60 degrees-dislocations with b = a/2 < 1 1 0 > originate from the 500 mN indents into the direction of the strongest temperature gradient. After 60 min at constant temperature an increase in the length and number of the dislocations in other directions is also observed. As a result of the continual thermal stressing dislocations develop from the 100 mN indents too. (C) 2009 Elsevier B.V. All rights reserved.
Autores:
Wittge, J.; Danilewsky, A.N.; Allen, D.; et al.
Revista:
JOURNAL OF APPLIED CRYSTALLOGRAPHY
ISSN:
0021-8898
Año:
2010
Vol.:
43
Págs.:
1036 - 1039
The nucleation of dislocations at controlled indents in silicon during rapid thermal annealing has been studied by in situ X-ray diffraction imaging (topography). Concentric loops extending over pairs of inclined {111} planes were formed, the velocities of the inclined and parallel segments being almost equal. Following loss of the screw segment from the wafer, the velocity of the inclined segments almost doubled, owing to removal of the line tension of the screw segments. The loops acted as obstacles to slip band propagation.
Autores:
Tamayo-Ariztondo, J.; Cordoba, J.M.; Oden, M.; et al.
Revista:
COMPOSITES SCIENCE AND TECHNOLOGY
ISSN:
0266-3538
Año:
2010
Vol.:
70
N°:
16
Págs.:
2269 - 2275
Cu is a well known heat sink material due to its high thermal conductivity. However, its coefficient of thermal expansion (CH) is high. One of the most promising solutions for reducing it is to reinforce copper with carbon nanofibres (CNF) because of their low CH. To exploit the properties of the CNFs a good dispersion of the reinforcement within the matrix must be achieved. One of the processing methods used to obtain a homogeneous CNF distribution is coating the CNF with Cu using electrochemical deposition. In this paper, the effect of the carbon structure on electroless deposition technique is studied. Different CNF have been compared: herringbone (HB), platelet (PL) and longitudinally aligned (previously heat treated) (LAHT). Herringbone and Platelet CNF were heat treated at 2750 degrees C for 30' which resulted in a structure resembling graphite with loops at the fibre surface. These loops are responsible for an enhancement of the copper coating. It is shown that the Cu coverage in electroless deposition is high for the graphene plane and poor at the edges of the plane. (C) 2010 Elsevier Ltd. All rights reserved.
Revista:
COMPOSITES SCIENCE AND TECHNOLOGY
ISSN:
0266-3538
Año:
2010
Vol.:
70
N°:
16
Págs.:
2227 - 2227
Autores:
Allen, D.; Wittge, J.; Zlotos, A.; et al.
Revista:
NUCLEAR INSTRUMENTS AND METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS
ISSN:
0168-583X
Año:
2010
Vol.:
268
N°:
3-4
Págs.:
383 - 387
In the semiconductor manufacturing industry, wafer handling introduces micro-cracks at the wafer edge. During heat treatment these can produce larger, long range cracks in the wafer which can Cause wafer breakage during manufacture. Two complimentary techniques, micro-Raman spectroscopy (mu RS) and White Beam Synchrotron X-ray Topography (WBSXRT) were employed to study both the micro-cracks and the associated strain fields produced by nano-indentations in Si wafers, which were used as a means of introducing controlled strain in the wafers. It is shown that both the spatial lateral and depth distribution of these long range Strain fields are relatively isotropic in nature. The Raman spectra suggest the presence of a region under tensile Strain beneath the indents, which can indicate a Crack beneath the indent and the data strongly Suggests that there exists a minimum Critical applied load below which Cracking will not initiate. (C) 2009 Elsevier B.V. All rights reserved.
Autores:
Marcos-Gomez, D.; Ching-Lloyd, J.; Elizalde, MR; et al.
Revista:
COMPOSITES SCIENCE AND TECHNOLOGY
ISSN:
0266-3538
Año:
2010
Vol.:
70
N°:
16
Págs.:
2276 - 2283
This paper compares the predicted values of the thermal conductivity of a composite made using the equivalent inclusion method (EIM) and the finite element method (FEM) using representative volume elements. The effects of inclusion anisotropy, inclusion orientation distribution, thermal interface conductance, h, and inclusion dimensions have been considered. Both methods predict similar overall behaviour, whereby at high h values, the effective thermal conductivity of the composite is limited by the inclusion anisotropy, while at lower h values, the effect of anisotropy is greatly diminished due to the more dominant effect of limited heat flow across the inclusion/matrix interface. The simulation results are then used to understand why in those cases where it has been possible to produce CNF reinforced Cu matrix composites with a large volume fraction of well dispersed CNFs, the measured thermal properties of the composite have failed to meet the expectations in terms of thermal conductivity, with measured conductivities in the range 200-300 W/m K. The simulation results show that, although degradation of the thermal properties of the CNFs and a poor interfacial thermal conductance are very likely the reasons behind the low conductivities reported, great care should be taken when measuring the thermal conductivity of this new class of materials, to avoid misleading results due to anisotropic effects. (C) 2010 Elsevier Ltd. All rights reserved.
Autores:
Ullbrand, J.M.; Cordoba, J.M.; Tamayo-Ariztondo, J.; et al.
Revista:
COMPOSITES SCIENCE AND TECHNOLOGY
ISSN:
0266-3538
Año:
2010
Vol.:
70
N°:
16
Págs.:
2263 - 2268
Several types of carbon nanofibres (CNF) were coated with a uniform and dense copper layer by electroless copper deposition. The coated fibres were then sintered by two different methods, spark plasma sintering (SPS) and hot pressing (HP). The Cu coating thickness was varied so that different volume fraction of fibres was achieved in the produced composites. In some cases, the CNF were pre-coated with Cr for the improvement the Cu adhesion on CNF. The results show that the dispersion of the CNF into the Cu matrix is independent of the sintering method used. On the contrary, the dispersion is directly related to the efficiency of the Cu coating, which is tightly connected to the CNF type. Overall, strong variations of the thermal conductivity (TC) of the composites were observed (20-200 W/mK) as a function of CNF type, CNF volume fraction and Cr content, while the coefficient of thermal expansion (CTE) in all cases was found to be considerably lower than Cu (9.9-11.3 ppm/K). The results show a good potential for SPS to be used to process this type of materials, since the SPS samples show better properties than HP samples even though they have a higher porosity, in applications where moderate TC and low CTE are required. (C) 2010 Elsevier Ltd. All rights reserved.
Autores:
Wittge,J.; Danilewsky, A.; Allen, D.; et al.
Revista:
POWDER DIFFRACTION
ISSN:
0885-7156
Año:
2010
Vol.:
25
N°:
2
Págs.:
99 - 103
The nucleation of dislocations at indents in silicon following rapid thermal annealing (RTA) has been examined by X-ray diffraction imaging (topography). For indentation loads below 200 mN, no slip bands were generated from the indent sites following RTA at 1000 degrees C under spike conditions. Upon plateau annealing at 1000 degrees C, slip dislocations were propagated from some indents but not all. Slip was also observed from edge defects not associated with indentation. For 500-mN indentation load, large scale dislocation sources were generated from the indent sites propagating on two of the four {111} slip planes. These dislocations multiplied into macroscopic-scale slip bands. A significant change in morphology was observed in the 60 degrees dislocation segments after the screw segment reached the rear surface of the wafer. Dislocations changed line direction and in some cases appeared to leave the Peierls trough during glide. (C) 2010 International Centre for Diffraction Data. [DOI: 10.1154/1.3392369]